________________________________________________________________________ http://www.union-ic.com rev.02 dec.2013 1/5 UESD16V8S4C quad line 12v esd pr otection diode array UESD16V8S4C sot23-6l general description the UESD16V8S4C of tvs diode array is designed to protect sensitive electronics from damage or latch-up due to esd, for high voltage applica tions where board space is at a premium. it is unidirectional device and may be used on lines wh ere the signal polarities are above ground, each device will protect up to four lines. tvs diodes are solid-state devices feature large cr oss-sectional area juncti ons for conducting high transient currents, specifically for transient s uppression. it offers desirable characteristics for board level protection including fast response time, low operating, low clamping voltage, and no device degradation. the UESD16V8S4C may be used to meet the im munity requirements of iec 61000-4-2, level 4. the small package makes them id eal for use in portable electr onics such as cell phones, pda?s, notebook computers, and digital cameras. applications features ? cellular handsets & accessories ? telecom equipment ? notebooks & handhelds ? portable instrumentation ? industrial pc ? industrial automation ? transient protection for data & power lines to iec 61000-4-2 (esd) 15kv (air), 8kv (contact) ? protect four i/o lines ? ultra-small sot23-6l package ? working voltages: 12v ? low leakage current ? low operating and clamping voltage ? solid-state silicon avalanche technology pin configurations top view m: month code UESD16V8S4C sot23-6l ordering information part number working voltage packaging type channel marking code shipping qty UESD16V8S4C 12.0v sot23-6l 4 ucj 3000pcs/7 inch tape & reel
________________________________________________________________________ http://www.union-ic.com rev.02 dec.2013 2/5 UESD16V8S4C absolute maximum ratings rating symbol value units peak pulse power (tp = 8/20 s) p p k 140 watts maximum peak pulse current (t=8/20 s) i pp 5.9 amps lead soldering temperature t l 260 (10 sec.) c operating temperature t j -55 to +125 c storage temperature t stg -55 to +150 c symbol definition parameter symbol maximum reverse peak pulse current i pp clamping voltage @ i pp v c working peak reverse voltage v rwm maximum reverse leakage current @ v rwm i r breakdown voltage @ i t v br test current i t forward current i f forward voltage @ i f v f peak power dissipation p p k max. capacitance @ v r = 0v, f = 1mhz c electrical characteristics (t=25c, device for 12.0v reverse stand-off voltage) parameter symbol conditions min t yp max unit reverse stand-off voltage v rwm 12 v reverse breakdown voltage v br it = 1ma 16 18 v reverse leakage current i r vrwm = 12v, t=25c 0.5 a clamping voltage v c i pp =5.9a, t p = 8/20 s 23 v junction capacitance c j v r = 0v, f = 1mhz 20 30 pf
________________________________________________________________________ http://www.union-ic.com rev.02 dec.2013 3/5 UESD16V8S4C applications information UESD16V8S4C esd protection diode is designed to protect quad data, i/o, or power supply line. the device is unidirectional and may be used on lines where the signal polarity is above ground. the cathode should be placed towards th e line that is to be protected. device connection for protection of quad data lines the quad tvs diode array is designed to protect up to four unidirectional data lines. the device is connected as follows: unidirectional protection of four i/o lines is achiev ed by connecting pins 1,3,4, and 6 to the data lines. pin 2 is connected to ground. the ground connection should be made directly to the ground plane for best results. the path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. circuit board layout recommendations for suppression of esd good circuit board layout is critical for the s uppression of esd induced transients. the following guidelines are recommended: place the tvs near the input terminals or c onnectors to restrict transient coupling. minimize the path length between the tvs and the protected line. minimize all conductive loops including power and ground loops. the esd transient return path to ground should be kept as short as possible. never run critical signals near board edges. use ground planes whenever possible. for multilaye r printed-circuit boards, use ground vias. keep parallel signal paths to a minimum. avoid running protection conductors in parallel with unprotected conductor. minimize all printed-circuit board conductiv e loops including power and ground loops. avoid using shared transient return paths to a common ground point.
________________________________________________________________________ http://www.union-ic.com rev.02 dec.2013 4/5 UESD16V8S4C package information UESD16V8S4C sot23-6l outline drawing dimensions symbol millimeters inches min max min max a 1.050 1.250 0.041 0.049 a1 0.000 0.100 0.000 0.004 a2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 d 2.820 3.020 0.111 0.119 e 1.500 1.700 0.059 0.067 e1 2.650 2.950 0.104 0.116 e 0.950ref 0.037ref e1 1.800 2.000 0.071 0.079 l 0.600ref 0.023ref l1 0.300 0.600 0.012 0.024 0 8 0 8 land pattern notes: 1. compound dimension: 2.921.60 2. unit: mm; 3. general tolerance 0.05mm unless otherwise specified; 4. the layout is just for reference. tape and reel orientation
________________________________________________________________________ http://www.union-ic.com rev.02 dec.2013 5/5 UESD16V8S4C important notice the information in this document has been ca refully reviewed and is believed to be accurate. nonetheless, this document is subjec t to change without notice. union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. union rese rves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. union semiconductor, inc add: 2f, no. 3, lane647 songtao road, shanghai 201203 tel: 021-51093966 fax: 021-51026018
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